Electronics Cooling
Electronics Cooling. Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
An Overview of Liquid Coolants for Electronics Cooling
2006年5月1日 · Coolants are used in both single phase and two-phase applications. A single phase cooling loop consists of a pump, a heat exchanger (cold plate/mini- or micro-channels), and a heat sink (radiator with a fan or a liquid-to-liquid heat exchanger with chilled water cooling) [3].
Articles - Electronics Cooling
2024年11月18日 · Electronics Cooling. Focused on Thermal Management, TIMs, Fans, Heat Sinks, CFD Software, LEDs/Lighting
Heat Pipes for Electronics Cooling Applications
1996年9月1日 · Only inthe past few years, however, has the electronics industry embraced heat pipes asreliable, cost-effective solutions for high end cooling applications. Thepurpose of this article is to explain basic heat pipe operation, review key heatpipe design issues, and to discuss current heat pipe electronic coolingapplications. Heat Pipe Operation
Advanced Cooling for Power Electronics
2017年7月12日 · This paper discusses cooling technologies that have evolved in step to remove increasing levels of heat dissipation and manage junction temperatures to achieve goals for efficiency, cost, and reliability. Cooling technologies rely on heat spreading and convection.
Advances In High-Performance Cooling For Electronics
The need for new cooling techniques is driven by the continuing increases in power dissipation of electronic parts and systems. In many instances standard techniques cannot achieve the required cooling performance due to physical limitations in heat transfer capabilities.
Thermal Management of Electronic Equipment using
2019年3月6日 · Phase Change Materials (PCMs) are a relatively new concept for the cooling of electronic systems. A PCM is used to absorb peak energy loads during power-on operation and to then reject that heat load at another time.
Micropumping Technologies for Electronics Cooling
2006年5月1日 · Integrated cooling designs are being investigated to eliminate some of the interface contact resistances introduced by add-on heat sinking and to minimize package volume. Forced convective liquid cooling through microchannel heat sinks is among the more promising technologies that have been proposed for achieving very high heat removal rates ...
About Us - Electronics Cooling
About Electronics Cooling. Electronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging.
Electronics Cooling. 2022 Annual Guide brings to you exciting articles, including Machine Learning . for Phase Change materials, advanced cooling solutions for Electric Vehicles and Green Transportation, enhanced manifold heat sink devices, advanced methodologies for wireless and mobile applications and many more.