Ryan Zrno, CEO of JST, discusses the ways in which the company, and the semiconductor industry more generally, is responding ...

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ACM Research has announced a major performance breakthrough for its flagship Ultra C Tahoe Cleaning tool. The resulting ...

NexGen Wafer Systems is excited to announce the launch of SERENO, its latest multi-chamber platform designed for Wet Etch and Clean applications. SERENO combines high performance with exceptional ...

Operator: Good day, ladies and gentlemen. Thank you for standing by and welcome to the ACM Research Fiscal Third Quarter 2024 ...

FREMONT, Calif., Nov. 07, 2024 (GLOBE NEWSWIRE) — ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging ...

As I said, 26 nano particle, adding about six particles only. So that's definitely equivalent to the single-wafer process capability. So with the continuum as improving the filtering system ...

Enhanced cleaning performance for advanced chip manufacturing; Significant chemical savings and environmental benefitsFREMONT, Calif., Nov. 07, 2024 (GLOBE NEWSWIRE) -- (“ACM”) (NASDAQ: ACMR), a ...

Semiconductor company Infineon (IFNNY) unveiled its new silicon power wafer this week that it says is the “world’s thinnest.” The new silicon wafers, which were developed for AI data centers ...

Thinning wafers to 20µm cuts substrate resistance in half and reduces power loss by 15% ... challenges such as high investment costs, particle control, and yield-related inefficiencies pose obstacles.

Following the news on the first 300mm GaN wafer, and the launch of the fab for 200mm SiC in Malaysia, Infineon revealed a few days ago another semiconductor manufacturing technological breakthrough ...

TrendForce reveals that HBM5 20hi stack products will adopt hybrid bonding technology by 2025, which could transform DRAM industry's business models ...