2024年10月31日，北方电子研究院安徽有限公司获得了国家知识产权局颁发的专利，专利名称为“一种简易的BGA植球装置”，授权公告号为CN108878316B。这一消息在业界引起广泛关注，标志着该公司在电子制造领域自主创新能力的显著提升。

Instead of convenient pins, BGA parts have tiny metallic balls on which solder is applied, a board is thrown through a reflow oven, and hopefully at the end, everything works. Sometimes these ...

In BGA chip packages, it is the tiny globe of solder that provides the contact between the chip package and the printed circuit board. Also called a "solder bump." See BGA. THIS DEFINITION IS FOR ...