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Semiconductor Engineering
5 小时
Backpropagation Algorithm On Neuromorphic Spiking HW (U. Of Zurich, ETH Zurich, LANL)
A new technical paper titled “The backpropagation algorithm implemented on spiking neuromorphic hardware” was published by ...
Semiconductor Engineering
20 小时
Research Bits: Nov. 25
The team used a 3D printing technique called direct ink writing (DIW), an extrusion process in which a paste with controlled ...
Semiconductor Engineering
20 小时
Why Silicon IP Has Become the Foundation of Modern SoC Design
Addressing challenges of using silicon IP, tracking IP cores, and taking advantage of the flexibility of modular design requires a proven process. It also requires a state-of-the-art IP management ...
Semiconductor Engineering
4 天
HBM Options Increase As AI Demand Soars
High-bandwidth memory (HBM) sales are spiking as the amount of data that needs to be processed quickly by state-of-the-art AI ...
Semiconductor Engineering
5 天
One Chip Vs. Many Chiplets
Challenges and options vary widely depending on markets, workloads, and economics.
Semiconductor Engineering
4 天
FOPLP Gains Traction in Advanced Semiconductor Packaging
Panel-level packaging offers scalability and cost efficiency, but meeting advanced node process targets remains a formidable ...
Semiconductor Engineering
4 天
Analysis Of Multi-Chiplet Package Designs And Requirements For Production Test Simplification
UCIe helps test through a fixed shoreline, multiple redundant lanes, and mission mode lane performance monitoring.
Semiconductor Engineering
4 天
The State Of The EDA Industry In 2024
A discussion with Jay Vleeschhouwer of Griffin Securities on EDA's continued consolidation, expansion into engineering ...
Semiconductor Engineering
11 天
Shift Left Is The Tip Of The Iceberg
A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be ...
Semiconductor Engineering
9 天
Asia Government Funding Surges
Taiwan, China, South Korea, and Japan continue to foster growth, while the rest of Asia competes for foreign investment and ...
Semiconductor Engineering
4 天
Luminary Panel Sees Progress In EUV Pellicle Adoption As Critical For EUV
Factors that impact mask lifetime, the future role of actinic inspection, and minimum mask dimensions for high-NA EUV.
Semiconductor Engineering
11 天
Managing The Huge Power Demands Of AI Everywhere
Before generative AI burst onto the scene, no one predicted how much energy would be needed to power AI systems. Those ...
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