【ITBEAR】微软近日在 Ignite 大会上正式揭晓了两款自主研发的数据中心核心芯片,标志着这家科技巨头在硬件领域的又一重要布局。这两款芯片分别是面向大数据处理的 Azure Boost DPU 和专注于云安全的 Azure Integrated ...
Microsoft has announced its new Azure Integrated Hardware Security Module (HSM) and Azure Boost DPU chips. The HSM is a cloud security chip that gives users full administrative and cryptographic ...
Microsoft has unveiled a new in-house Data Processing Unit (DPU) named Azure Boost DPU. This DPU is designed to bolster the efficiency of Microsoft’s Azure cloud-based services by upgrading the ...
“智算琢光”芯片作为首颗全面支持GSE标准的DPU芯片,其性能表现尤为亮眼。该芯片支持高达200G的端口速率,并集成了GSE协议特有的报文容器喷洒以及基于DGSQ的拥塞控制机制等先进技术。同时,该芯片已与业界多家主流交换芯片完成了对接验证,确保了其在 ...
The Azure Boost DPU is Microsoft’s first data processing unit, designed for “data-centric workloads with high efficiency and low power,” the company said. Microsoft expects future DPU ...
Microsoft CEO Satya Nadella told customers at a conference in Chicago on Tuesday that the company is teaching a new set of ...
DPU芯片——“智算琢光”。这一创新成果标志着中国在新型智算中心网络高性能DPU芯片领域取得了重大突破,填补了相关领域的空白。RMVesmc “智算琢光”芯片是首颗全量支持GSE标准的DPU芯片,具备200G端口速率,并支持GSE协议特有的报文容器喷洒以及基于DGSQ的 ...
Microsoft has designed two additional infrastructure chips for its data centers that will help speed artificial intelligence ...