A discussion with Jay Vleeschhouwer of Griffin Securities on EDA's continued consolidation, expansion into engineering ...

High-bandwidth memory (HBM) sales are spiking as the amount of data that needs to be processed quickly by state-of-the-art AI ...

Device design begins with the anticipated workload. What is it actually supposed to do? What resources — computational units, ...

UCIe helps test through a fixed shoreline, multiple redundant lanes, and mission mode lane performance monitoring.

Factors that impact mask lifetime, the future role of actinic inspection, and minimum mask dimensions for high-NA EUV.

Panel-level packaging offers scalability and cost efficiency, but meeting advanced node process targets remains a formidable ...

Challenges and options vary widely depending on markets, workloads, and economics.

SK hynix's 321-high NAND; Cadence's system chiplet; Eliyan's interconnect chiplet; CEO turnovers; GF's funding finalized; SRC's digital twin win; chiplets ramp; Enfabrica funding; NAND flash standard.

A new IEEE technical paper titled “Package Assembly Design Kits (PADK’s)- The Future of Advanced Wafer-Level Manufacturing” ...

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how ...

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be ...

Taiwan, China, South Korea, and Japan continue to foster growth, while the rest of Asia competes for foreign investment and ...